公司名稱

台灣積體電路製造股份有限公司

工作地點

台灣

專業領域

研究發展

職別

工程師/管理師

職務類型

正職

職務張貼日

2026/05/28

台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。

Join our R&D Advanced Packaging team and be at the forefront of developing world class packaging solutions that will power the world's most advanced electronics, enable AI platform solution foundries, and influence the entire industry ecosystem.

職務說明

1. Lead the development and integration of novel advanced packaging technologies, processes, and materials.

2. Design, execute, and analyze experiments to optimize packaging performance, reliability, and cost.

3. Collaborate cross-functionally with design, module, and operations teams to ensure seamless integration and manufacturability.

4. Identify and troubleshoot complex technical challenges in packaging integration, driving root cause analysis and solutions.

5. Contribute to the strategic roadmap for advanced packaging, evaluating new technologies and intellectual property.

職務要求

1. MS or Ph.D. in Electrical, Mechanical, Chemical, Materials Science, Physics, or a related engineering/science discipline.

2. Possesses strong technical problem-solving and analytical skills, grounded in fundamental principles, with a proactive, hands-on approach and a strong sense of ownership; consistently demonstrates a growth mindset for continuous learning and development.

3. Exceptional team player who fosters trust, drives innovation with disciplined execution, and is fluent in both Mandarin and English with excellent cross-functional communication skills.

營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。