Direkt zum Inhalt
Unternehmen
Taiwan Semiconductor Manufacturing Company Limited
Ort
Taiwan
Karrierebereich
Forschung & Entwicklung
Art des Jobs
Ingenieur / Verwaltung
Art der Beschäftigung
Regulär
Veröffentlicht
28.05.2026
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
Join our R&D Advanced Packaging team and be at the forefront of developing world class packaging solutions that will power the world's most advanced electronics, enable AI platform solution foundries, and influence the entire industry ecosystem.
Zuständigkeiten
1. Lead the development and integration of novel advanced packaging technologies, processes, and materials.
2. Design, execute, and analyze experiments to optimize packaging performance, reliability, and cost.
3. Collaborate cross-functionally with design, module, and operations teams to ensure seamless integration and manufacturability.
4. Identify and troubleshoot complex technical challenges in packaging integration, driving root cause analysis and solutions.
5. Contribute to the strategic roadmap for advanced packaging, evaluating new technologies and intellectual property.
Qualifikationen
1. MS or Ph.D. in Electrical, Mechanical, Chemical, Materials Science, Physics, or a related engineering/science discipline.
2. Possesses strong technical problem-solving and analytical skills, grounded in fundamental principles, with a proactive, hands-on approach and a strong sense of ownership; consistently demonstrates a growth mindset for continuous learning and development.
3. Exceptional team player who fosters trust, drives innovation with disciplined execution, and is fluent in both Mandarin and English with excellent cross-functional communication skills.
Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.