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公司名稱
台灣積體電路製造股份有限公司
工作地點
台灣
專業領域
連線與封裝技術
職別
工程師/管理師
職務類型
正職
職務張貼日
2023/08/03
職務說明
1. Responsible for new SoIC technology development, including Si wafer handling and process improvement.
2. Project handling and resource allocation.
3. Process loop development.
4. Coordinate with customers for key issue analysis, aim to improve customer collaboration experience.
職務要求
1. Si handling skill for front-end, back-end, and far back-end is required.
2. Cross-team communication and good coordination skills.
3. Process issue analysis and problem-solving skills are required.
4. Customer communication and engagement skills are required.