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Job Category
IC Interconnect & Packaging Technology
Job Type
Engineer / Admin
Employment Type
Aug 03, 2023
Job Responsibilities
1. Responsible for new SoIC technology development, including Si wafer handling and process improvement.
2. Project handling and resource allocation.
3. Process loop development.
4. Coordinate with customers for key issue analysis, aim to improve customer collaboration experience.
Job Qualifications
1. Si handling skill for front-end, back-end, and far back-end is required.
2. Cross-team communication and good coordination skills.
3. Process issue analysis and problem-solving skills are required.
4. Customer communication and engagement skills are required.