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公司名稱
台灣積體電路製造股份有限公司
工作地點
台灣
專業領域
連線與封裝技術
職別
工程師/管理師
職務類型
正職
職務張貼日
2024/03/19
職務說明

1. Develop and implement test plans for HBM components and systems

2. Perform testing to validate design and ensure compliance with industry standards

3. Develop test programs and scripts to automate testing processes

4. Work with cross-functional teams to identify and resolve issues

5. Analyze test data and provide recommendations for design improvements

6. Collaborate with customers to understand their requirements and provide technical support

7. Keep up-to-date with industry trends and advancements in HBM technology

職務要求

1. Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field

2. 3+ years of experience in test engineering, with a focus on HBM technology

3. Strong programming skills in languages such as Python, C++, or Java

4. Experience with test equipment such as oscilloscopes, logic analyzers, and signal generators

5. Familiarity with industry standards such as JEDEC, DDR, and PCIe

6. Excellent problem-solving and analytical skills

7. Strong communication and collaboration skills

8. Ability to work independently and manage multiple tasks simultaneously