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Job Category
IC Interconnect & Packaging Technology
Job Type
Engineer / Admin
Employment Type
Mar 19, 2024
Job Responsibilities

1. Develop and implement test plans for HBM components and systems

2. Perform testing to validate design and ensure compliance with industry standards

3. Develop test programs and scripts to automate testing processes

4. Work with cross-functional teams to identify and resolve issues

5. Analyze test data and provide recommendations for design improvements

6. Collaborate with customers to understand their requirements and provide technical support

7. Keep up-to-date with industry trends and advancements in HBM technology

Job Qualifications

1. Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field

2. 3+ years of experience in test engineering, with a focus on HBM technology

3. Strong programming skills in languages such as Python, C++, or Java

4. Experience with test equipment such as oscilloscopes, logic analyzers, and signal generators

5. Familiarity with industry standards such as JEDEC, DDR, and PCIe

6. Excellent problem-solving and analytical skills

7. Strong communication and collaboration skills

8. Ability to work independently and manage multiple tasks simultaneously