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公司名稱
台灣積體電路製造股份有限公司
工作地點
台灣
專業領域
連線與封裝技術
職別
工程師/管理師
職務類型
正職
職務張貼日
2024/03/19
職務說明

1. Develop, test, and integrate HBM solutions into products.

2. Collaborate with cross-functional teams to ensure successful integration of HBM solutions. 

3. Work closely with memory vendors to develop and optimize HBM solutions. 

4. Create and maintain technical documentation related to HBM integration and testing. 

5. Troubleshoot and resolve issues related to HBM integration and performance. 

6. Participate in the development of new products and technologies related to HBM.

職務要求

1. Bachelor's degree in Electrical Engineering, Computer Science, or related field. 

2. 5+ years of experience in memory design and integration. 

3. Strong understanding of HBM technology and its implementation. 

4. Experience with memory controller design and testing. 

5. Knowledge of circuit design, signal integrity, and power delivery. 

6. Excellent problem-solving skills. 

7. Strong communication and interpersonal skills.