Skip to content
Location
Taiwan
Job Category
IC Interconnect & Packaging Technology
Job Type
Engineer / Admin
Employment Type
Regular
Posted
Mar 19, 2024
Job Responsibilities

1. Develop, test, and integrate HBM solutions into products.

2. Collaborate with cross-functional teams to ensure successful integration of HBM solutions. 

3. Work closely with memory vendors to develop and optimize HBM solutions. 

4. Create and maintain technical documentation related to HBM integration and testing. 

5. Troubleshoot and resolve issues related to HBM integration and performance. 

6. Participate in the development of new products and technologies related to HBM.

Job Qualifications

1. Bachelor's degree in Electrical Engineering, Computer Science, or related field. 

2. 5+ years of experience in memory design and integration. 

3. Strong understanding of HBM technology and its implementation. 

4. Experience with memory controller design and testing. 

5. Knowledge of circuit design, signal integrity, and power delivery. 

6. Excellent problem-solving skills. 

7. Strong communication and interpersonal skills.