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公司名稱
台灣積體電路製造股份有限公司
工作地點
台灣
專業領域
IC 設計技術
職別
主管職
職務類型
正職
職務張貼日
2023/08/03
職務說明
1. Lead APR team on tapeout projects, includes physical design and signoff
2. Responsible for advanced technology APR & 3DIC design solution research and development
3. Innovations on APR and 3DIC design domains
4. Cross sites projects coordination and management
職務要求
1. Master or PhD Computer engineering or EE with 6+ years of experience in physical design
2. Familiar with PnR and Signoff (Physical verification, PDN, timing)
3. Familiar with programming languages (shell, python, TCL) & C/C++
4. Familiar with 3DIC implementation flow is a plus
5. Open communication and teamwork spirit
6. Proactive and creativity
7. Good at English and Chinese