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Job Category
IC Design Technology
Job Type
Employment Type
Aug 03, 2023
Job Responsibilities
1. Lead APR team on tapeout projects, includes physical design and signoff
2. Responsible for advanced technology APR & 3DIC design solution research and development
3. Innovations on APR and 3DIC design domains
4. Cross sites projects coordination and management
Job Qualifications
1. Master or PhD Computer engineering or EE with 6+ years of experience in physical design
2. Familiar with PnR and Signoff (Physical verification, PDN, timing)
3. Familiar with programming languages (shell, python, TCL) & C/C++
4. Familiar with 3DIC implementation flow is a plus
5. Open communication and teamwork spirit
6. Proactive and creativity
7. Good at English and Chinese