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公司名稱
台灣積體電路製造股份有限公司
工作地點
台灣
專業領域
IC 設計技術
職別
工程師/管理師
職務類型
正職
職務張貼日
2023/08/03
職務說明
1. Advanced
2. 5D and 3D packaging technology development.
3. Design flows, including APR, EM/IR, Thermal, and SI/PI, enablement.
4. Design kits generation and QA.
5. 3DIC solution adoption support with key customers.  
職務要求
1. 3-year technical experience and knowledge of digital APR flows.
2. Familiar with design solutions provided by either one of listed EDA vendors: Ansys, Cadence, Mentor, and Synopsys.
3. Good programing skills, such as C++, Python, Perl, Tcl.
4. Self-motivated with ability to solve complex problems.
5. Excellent verbal and written communication skills in English.