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Job Category
IC Design Technology
Job Type
Engineer / Admin
Employment Type
Aug 03, 2023
Job Responsibilities
1. Advanced
2. 5D and 3D packaging technology development.
3. Design flows, including APR, EM/IR, Thermal, and SI/PI, enablement.
4. Design kits generation and QA.
5. 3DIC solution adoption support with key customers.  
Job Qualifications
1. 3-year technical experience and knowledge of digital APR flows.
2. Familiar with design solutions provided by either one of listed EDA vendors: Ansys, Cadence, Mentor, and Synopsys.
3. Good programing skills, such as C++, Python, Perl, Tcl.
4. Self-motivated with ability to solve complex problems.
5. Excellent verbal and written communication skills in English.