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公司名稱
台灣積體電路製造股份有限公司
工作地點
台灣
專業領域
研究發展
職別
工程師/管理師
職務類型
正職
職務張貼日
2026/03/17
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。
R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations.
職務說明
1. Research & Pathfinding

(1) New material and new process pathfinding to enable new device architecture with integration.
(2) New tool pathfinding for new materials to enable the next nodes.
(3) Design, execute and analyze experiments to meet R&D engineering specifications.
(4) Process stability & manufacturability improvement for yield and reliability qualification.
(5) Process/tool transfer to development R&D or volume manufacturing (Fab).
(6) Highly motivated individuals with a strong technical background and teamwork skills.
 
2. Integration

(1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc.
(2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc.
(3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies.
(4) Customer design enablement: SPICE Modeling and IP qualifications.
 
3. Module

(1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies.
(2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification.
(3) Transfer process and tool to high volume manufacturing fab.
 
4. R&D Process Center

(1) PE: Advanced module process development and baseline sustaining.
(2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. 
(3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations.
職務要求
1. Passionate about the development of world-leading technologies.
2. Master's degree or above in an engineering or scientific field such as Materials Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics.
3. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics.
4. Exhibit good and open communication skills and be able to work within cross-functional teams, including internal and external partners.
5. Fluent in English.
6. Skills in AI and programming are preferred.
7. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Having knowledge of machine learning or artificial intelligence is an added advantage.
8. Flexibility in changing priorities and responsibilities to support business needs.
9. Hands-on participation on process or hardware and a strong sense of ownership.
10. Willing to make frequent fab presence.
11. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required.
12. Excellent written and spoken communication skills are required.


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營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。