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公司名稱
TSMC Japan Limited
工作地點
日本-筑波市
職務張貼日
2024/05/17

Role

Manage advanced substrate technology development and pathfinding activities 
Define key technology building blocks to enable advanced package substrate architectures  
Lead suppliers to design/execute module DOE and come up with preliminary recipes  
Support substrate development engineer to improve supplier process robustness by driving CIPs
Explore new tools/processes for next-generation substrate requirements
 

Qualifications

5 years+ experience with packaging substrate industry
Familiar with substrate process/tools/materials
Knowledgeable of process development methodology
Bac./Master/Ph.D. in Materials Science, Mech./Chem. Eng. or related Eng. field

 

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