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公司名稱
TSMC Design Technology Japan, Inc.
工作地點
日本-橫濱市
職務張貼日
2022/05/18

Job Description

• Defect modeling and test methodology development for advanced process nodes, advanced packaging technologies
• Perform top/block-level DFT insertion including scan compression, boundary scan, 1500 wrapper, ATPG and pattern simulation
• Verify DFT circuitry and interface with other blocks, debug timing simulation issues
• Closely work with physical design team to resolve timing constraints/issues
• Be able to quickly understand problem statements and innovate solutions for DFT, diagnosis and yield learning
• Work independently and own the task from DFT specification to final pattern delivery

 

■Qualification

• BCH and above in EE, CS related fields.
• 3-15 years of hands-on experience with DFT and test flow with commercial EDA tools for large and complex SOCs
• Strong fundamental knowledge of DFT techniques include JTAG, ATPG, yield learning, logic diagnosis, Scan compression, IEEE 1500 Std. and MBIST  
• Experience with Synopsys DFT Complier, Tetramax and VCS is required. Experience with Tessent and Modus/Encounter tool suite is a plus
• Strong programming skills in Python/TCL and shell scripting is required
• Proficiency in English is a must"