内容へスキップ
会社
台湾積体電路製造股份有限公司
会社所在地
台湾
職種
研究開発
職種
エンジニア／管理者
雇用形態
正社員
投稿日
2026/07/08
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
職務内容
Come and join an innovative and challenging team, where groundbreaking ideas shape the future of semiconductor technology. As an R&D Engineer, you will work on advanced technology development, such as exploratory research in advanced device architectures, device and process integration for manufacturability, advanced module process development, as well as the evaluation of novel materials, equipment, and processes.

1. Research & Pathfinding

(1) New material and new process pathfinding to enable new device architecture with integration.
(2) New tool pathfinding for new materials to enable the next nodes.
(3) Design, execute and analyze experiments to meet R&D engineering specifications.
(4) Process stability & manufacturability improvement for yield and reliability qualification.
(5) Process/tool transfer to development R&D or volume manufacturing (Fab).
(6) Highly motivated individuals with a strong technical background and teamwork skills.

2. Integration

For Device Engineers:

(1) Transistor Architecture & Design: Pioneering device design for advanced nodes.
(2) Advanced Characterization: Defining the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting bench electrical measurements (I-V, C-V).
(3) Simulation & Modeling: Utilizing TCAD (Technology Computer-Aided Design) and HSPICE to simulate device characteristics, optimize performance, and fortify model integrity.
(4) Test Key Design: Crafting precision test key designs to facilitate accurate electrical modeling, design rule validation, and comprehensive device characterization.
(5) Customer design enablement: Providing SPICE Model.

For Integration Engineers (or Process Integration Engineers) :

(1) Process Flow Integration: Integrating devices across various process modules (Lithography, Etch, Thin Films/Epi, Diffusion, CMP) to build a robust, manufacturable baseline for yield and device learning.
(2) Experimentation & Lot Handling: Designing advanced Experiments (DOE) to meet device KPIs. Periodically serving as the on-duty engineer to coordinate and handle device lots in the R&D fab.
(3) Yield & Reliability Learning: Conducting big data analysis (using JMP, Python, or custom iEDA tools) to identify process design weaknesses, hardware issues, or yield detractors.
(4) Technology Transfer: Transitioning the proven, optimized advanced integration baseline process from the R&D phase to fab for high-volume manufacturing.

3. Module R&D Engineer

(1) Pioneer Next-Generation Technologies: Research and develop advanced processes, novel materials, next-generation tooling, and cutting-edge computational/simulation methodologies for leading-edge semiconductor nodes.
(2) Drive High-Impact Innovation: Deliver highly manufacturable, stable, and cost-effective process technologies. Optimize device physics and performance to meet stringent yield, reliability, and qualification standards.
(3) Bridge Lab-to-Fab Scaling: Lead the technology transfer of advanced processes and hardware solutions from R&D phase to High-Volume Manufacturing (HVM) fabs, witnessing your research scale into global production.

4. R&D Process Center

(1) PE: Develop advanced module process, optimizing stability and manufacturability to ensure high yield and reliability. Transfer processes and tools to volume manufacturing while collaborating with cross-functional teams and external suppliers to drive leading-edge module integration. Additionally, manage day-to-day operations, troubleshoot equipment, and mentor technicians to sustain operational excellence.
(2) EE: Manage advanced semiconductor equipment (Diffusion, Thin Film, Lithography, or Etching) by performing warm-ups, troubleshooting, and efficiency enhancements. Plan and execute defect detection projects to analyze performance while collaborating closely with cross-functional engineers and vendors to ensure optimal equipment productivity and stability.
(3) MFG: Oversee daily IC foundry operations, managing work schedules, direct labor, and cross-functional collaboration (PE/PIE/EQ) to ensure consistent service delivery. Drive productivity, manage multiple projects with overlapping deadlines, and analyze data to keep operations running smoothly. Additionally, contribute to process improvements and maintain robotic/detection systems to meet customer and business objectives.
職務資格
1. Master’s degree or Ph.D. in Electrical Engineering, Materials Science & Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry, Optics, or a related scientific/engineering field.
2. Solid understanding of semiconductor physics, chemistry, fabrication equipment, and process integration flows.
3. Strong knowledge of Design of Experiments (DOE) and Statistical Process Control (SPC) principles. Proficiency in programming, data analytics, or machine learning/AI is a plus.
4. Strong technical problem-solving and analytical skills, with a focus on fundamental reasoning rather than purely empirical methods.
5. Hands-on experience with process or hardware tools; a strong sense of ownership and readiness for active presence in an R&D fab/cleanroom environment.
6. Fluent in English with excellent written and verbal communication skills; proven ability to collaborate effectively in cross-functional teams and with external partners.
7. Passionate about pioneering next-generation technologies, with the flexibility to adapt to dynamic R&D environments and evolving business needs.

#LI-DNI
TSMC 価値観
TSMCは、私たちのビジョンと価値観に共感していただき、会社の持続的な成功に貢献していただける仲間を募集しています。私たちのコアバリューは、企業文化を形成する礎であり、すべての決断や行動の指針であります。以下のプリンシプルに心が響き、業務に体現していただける応募者を心よりお待ちしています。 
  • 誠実さ： 私たちは事実のみを語り、誇張や虚飾はしません。私たちは軽率に約束することはありません。一度約束したら、全力を尽くして守ります。
  • コミットメント：コミットメントは社員と会社の間に存在する双方向性です。社員は会社に対してロイヤリティを持ち、会社の成功は自分の成功であると心構え、勤勉に働いてベストを尽くします。一方で、会社は社員の利益を最大限に考慮するよう尽力します。 
  • イノベーション： イノベーションは会社成長の源泉です。新しいアイデアを発想することに留まらず、そのアイデアを実践するこそがイノベーションです。 
  • お客様の信頼：私たちは、お客様と深く永続的なパートナーシップを築くことに尽力します。長期にわたり、お客様の成功を支える、頼れるパートナーであり続けます。
 (TSMCのコアバリューに関する詳細は、こちらをご参照ください：https://www.tsmc.com/japanese/aboutTSMC/values)
Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.