TSMC

1. Semiconductor devices and memories development, electrical characterization methodology & physics, and TCAD.
2. Semiconductor processes, material science, equipment/tools, and machine learning and AI for modeling - plasma physics, surface chemistry reaction, selective deposition on dielectric/conductor, electro-chemistry, atomic-layer deposition/etch, organic/in-organic chemistry synthesis, physical chemistry, lithography, e-beam, chemical vapor deposition, physical vapor deposition, and vacuum system.
3. Exotic devices and materials - spintronics, magnetism, two-dimensional (2D) materials.
4. Compact modeling about semiconductor electrical/magnetic devices, silicon photonics, microelectromechanical system (MEMS) and bio-sensor.
5. Algorithm development for model extraction/characterization or methodology for new applications of SPICE simulation.
6. First-principles modeling of material characteristics (e.g., electrical, magnetics), material design and synthesis for nano-scale fabrication.
7. Electronic design automation (EDA) and methodology, focusing on tool/methodology for future design-technology co-optimization (DTCO), Memory for AI compute, 3D Memory-Logic Integration.
8. Next-generation design architectures, including three-dimensional IC (3DIC), power distribution network, standard cells, memory, input/output (IO), Analog and Radio-Frequency design (RF), etc.
9. 3DIC/advanced packaging-related (Developing the best PPAC interconnect and packaging integration technology to integrate different semiconductor elements as one system)
10. Other semiconductor-related topics.

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• 相關問題，歡迎來信連絡 王小姐 YSWANGZW@TSMC.COM