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Job Category
Manufacturing (fabs)
Job Type
Engineer / Admin
Employment Type
Jun 25, 2024
To face the fierce market competition, TSMC must continuously maintain technological leadership and shorten the research and development cycle time, to expand its competitive advantage. Therefore, RDPC needs to work closely with various R&D departments to achieve the fastest, highest quality, and most cost-effective process development.

Our Goal :

1. Reduce cycle time:
The R&D process requires continuous design of experiments (DOE) and verification to ensure process reliability and mass production. However, it takes time to know the results of these experiments from chip tape-out to experiment results. Therefore, we must strive to shorten the research and development cycle time to obtain results and make improvements in the shortest possible time.

2. Stability:
The equipment on the R&D line needs to be maintained and improved by RDPC. The R&D center is at the forefront of technology, and many machines are the first of TSMC. Therefore, RDPC's process and equipment engineers must have the ability to "put on clothes and modify clothes" to ensure the stability and optimal operation of the equipment.

3. Variation control:
Minimizing process variation is also an important task for RDPC. With the advancement of the process, the tolerance of process window becomes smaller. Therefore, precise process control is crucial for stable and high-yield processes (variation control is key).

4. Transfer to HVM:
Success or failure depends on the ability to mass-produce the research and development results. Therefore, seamless transfer and successful mass production are our only goals to achieve the success and development of the company.

5. From Moore's Law to the era of AI Era/3D IC:
Transitioning from artificial intelligence to smart manufacturing, through the strategies and collaborations of tech giants, unlocking the future of the global semiconductor industry.
Job Responsibilities
1. Leading advanced module process development during the R&D stage.
2. Enhancing process stability and manufacturability to improve yield and reliability for qualification.
3. Overseeing process/tool transfer to volume manufacturing.
4. Working with teams that include IIP/3D IC module, device, integration, yield, lithography, thin films, and external suppliers to drive leading-edge integrated module development, control, and improvements.
5. Maintaining ownership of day-to-day operations, equipment troubleshooting, and mentoring technicians.
Job Qualifications
1. Master's degree or above in Chemical Engineering, Material Science, Chemistry, Physics, or a related engineering discipline is required.
2. Strong hands-on participation and a strong sense of ownership are required.
3. Demonstrated technical problem-solving and analytical skills, based on fundamental rather than empirical models.
4. Excellent written and verbal communication skills are required.
5. Experience in IC fabrication would be an added advantage.
6. Proficiency in both Mandarin and English.