Skip to content
Company
TSMC Japan 3DIC R&D Center, Inc.
Location
Japan-Tsukuba
Posted
May 17, 2024

Role

Manage internal/external(customer) substrate test vehicle build, and execute substrate technology roadmap validation (DOE, process window validation and etc.) 
Responsible for full lifecycle health of new tape outs (NTO) and new product introduction (NPI). Ensure substrate on-time delivery and its outgoing quality/ reliability.
Direct interface with suppliers by leading engineering/operational meetings to track all the project readiness vs. setting targets/timelines. Provide a recovery plan for lagging tasks.
Drive continuous process improvement and yield enhancement activities. 
Collaborate with suppliers and internal material research group to define next-generation packaging substrate needs of new materials – build up dielectrics, solder resist…
 

Qualifications

 

  • 5 years+ experience with packaging substrate industry
  • Good data analytic capability (statistics, DOE)
  • Proven records of technical program management and problem-solving
  • Bac./Master/Ph.D. in Materials Science, Mech./Chem. Eng. or related Eng. field

 

About us