Company

TSMC Japan 3DIC R&D Center, Inc.

Location

Japan-Tsukuba

Posted

Sep 27, 2024

Role

Manage packaging materials design rules for internal/external(customer) design guidance.

Lead design for manufacturing review, identify the gaps, and align with various teams to come up with final design for yield/reliability optimization.

Collaborate with simulation team to define/proceed thermomechanical and electrical simulation.
Provide summary of design hot spots for modification reference.

 

Qualifications

 

• 5 years+ experience with with semiconductor industry.
• Proven technical problem-solving skills.
• Engineering BS/MS/Ph.D.

 

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