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Company
Taiwan Semiconductor Manufacturing Company Limited
Location
Taiwan
Career Area
More-than-Moore Technology
Job Type
Engineer / Admin
Employment Type
Regular
Posted
Apr 09, 2025
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

In R&D, special technologies and mature processes are necessary for the continuous stable growth of TSMC.
More-than-Moore Specialty Technology (MtM) builds on this firm foundation to develop new technologies, expand into new fields, and develop diverse product applications such as image sensing components, embedded technology, analog power and special technology, analog and sensing components, and special modules.
Job Responsibilities
1. R&D Process Engineer (Etch) 
    
    (1) A highly motivated individuals with a strong technical background and capabilities to develop and sustain etch 
          process technologies for R&D specialty products. 
    (2) Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians. 
    (3) Co-work with other module, integration, or external suppliers to drive leading-edge integrated module development, control and 
          improvements.

2. R&D Process Engineer 
  
    (1) Responsible for CVD/PVD/CMP/Grind/Trim development activities in R&D specialty module. 
    (2) Deliver innovation and solution to conquer the problems in wafer stacking processes. 
    (3) Maintain processes POR and SPC control.

3. R&D Integration Engineer 

     (1) Responsible for lot handling and process flow setup. 
     (2) Process flow optimization to improve WAT or yield performance. 
     (3) Need support holiday on-duty.
Job Qualifications
1. Minimum Master degrees in an engineering and scientific field such as Materials Science, Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics.
2. 1 year or more in :
    (1) CVD/PVD/CMP/Grind/Trim process 
    (2) integration for semiconductor is a plus.

3. Solid technical understanding of IC processing equipment, integrated flow, chemistry and physics.
4. Good communication with module engineers and team work.
5. Strong in technical background and data analysis skills.
6. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
7. Flexibility in changing priorities and responsibilities to support business needs.
8. Hands-on participation and a strong sense of ownership.
9. English capability is a plus.

Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.