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Location
Taiwan
Job Category
IC Interconnect & Packaging Technology
Job Type
Engineer / Admin
Employment Type
Regular
Posted
Mar 19, 2024
Job Responsibilities

1. Develop and implement test methodologies for HBM packages

2. Design and develop test hardware and software

3. Collaborate with design and product teams to ensure package designs meet specifications

4. Develop and execute test plans to validate package designs

5. Analyze test data and provide feedback to design and product teams

6. Develop and maintain test documentation and procedures

7. Participate in cross-functional teams to resolve issues and improve processes

8. Stay up-to-date with industry standards and trends

Job Qualifications

1. Bachelor's degree in Electrical Engineering or related field

2. 3+ years of experience in package test development

3. Experience with HBM package test development is highly desired

4. Strong understanding of semiconductor packaging technology

5. Experience with test hardware and software development

6. Familiarity with statistical analysis tools and techniques

7. Excellent communication and collaboration skills

8. Ability to work independently and as part of a team

9. Strong problem-solving skills