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Company
Taiwan Semiconductor Manufacturing Company Limited
Location
Taiwan
Career Area
R&D
Job Type
Manager / Executive
Employment Type
Regular
Posted
Apr 18, 2025
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
Job Responsibilities
1. Responsible for leading a group of designers to perform R&D works to evaluate PPA of circuit-level novelties and tapeout proof-of-concept chips.
2. Coordinate with multifunctional teams across Device, Circuit, and System in R&D.
3. Collaborate with external university and industry partners on research topics.
4. Convert results of innovative research into patents and publications.
Job Qualifications
Required Qualifications

1. Master's Degree or above in Electrical/Electronic Engineering
2. Minimum 5 years of experience in circuit design
3. Fluency in English is required; fluency in Mandarin is a plus
4. Solid background in circuit design and hands-on experience with a tapeout flow

Preferred Qualifications

1. Basic understanding of emerging memory, AI accelerator, or memory controller functionality.
2. In-depth knowledge in one or more areas of memory technology (SRAM, RRAM, MRAM, and PCRAM), memory macro (sense amplifier, write circuitry, LDO, charge pump, and ADC/DAC), or accelerator designs (in-memory compute, near-memory computing, and systolic array).
3. Minimum 5 years of experience in circuit design and tape out using either custom or digital design flow.
4. A strong publication, patent, and research collaboration history is a huge advantage.
5. Track record of research excellence or significant product development.
6. Excellent communication and collaboration skills.