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Company
Taiwan Semiconductor Manufacturing Company Limited, TSMC
Location
Taiwan
Job Type
Engineer / Admin
Employment Type
Regular
Posted
Jul 09, 2024
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
Job Responsibilities
As a member of the IIP (Integrated Interconnect & Packaging) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, Coupe and SoIC process/integration development for customer's variety applications. 

1. Integration

(1) Develop advanced 3DIC (InFO, CoWoS, Coupe and SoIC) process and sustain baseline.
(2) Package level reliability, failure mode analysis and improvement plan.
(3) Customer technical interface, new tape out and lot handle.
(4) Handover developed technologies to manufacturing groups for production.

2. Module Development

(1) Be responsible for CVD/PVD/CMP/Lithography/Etch/Polymer/Bonding/Clean module development for 3DIC projects.
(2) New technology, materials survey, and process improvement on 3DIC package structures.
(3) Process development and tool transfer to mass-production development.

3. Simulation

(1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment.
(2) Practice FEM and DOE in problem solving and path finding particularly on packaging.
(3) Continue improvement in simulation methodology, material modeling and script automation.
Job Qualifications
1. Master's degree or above in Chemical Engineering, Material Science, Chemistry, Physics, Mechanical Engineering, or related field in science or engineering.
2. Experience in TV design or IC packaging is a plus.
3. Good communication skills in Chinese and English.
4. Hands-on participation and a strong sense of ownership are required.
5. Strong technical problem-solving and analytical skills.
6. For simulation positions, mastery of FEM software such as Ansys, LS-DYNA, Abaqus and others.

Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.