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Unternehmen
Taiwan Semiconductor Manufacturing Company Limited
Ort
Taiwan
Karrierebereich
Forschung & Entwicklung
Art des Jobs
Manager / Führungskraft
Art der Beschäftigung
Regulär
Veröffentlicht
03.09.2024
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
Zuständigkeiten
1. Lead a team of highly motivated R&D engineers to develop numerical analysis methodology to support novel 3DIC integration technology development.
2. Support the existing in-house simulation and analysis framework to deliver reliable, accurate and effective results to customers. 
3. Collaborate with EDA/CAD software vendors to solve problems emerged in advanced semiconductor and 3DIC technology.
Qualifikationen
1. Excellent technical knowledge and experience using CAD, FEA, and numerical analysis tools such as ANSYS, Abaqus, LS-Dyna, HyperMesh and COMSOL.
2. Master's degree in Mechanical, Civil Engineering, Applied Mathematics, Computer Science, or a related field with 10+ years of experience.
3. Familiar with material, fracture mechanics, heat conduction, and numerical methodologies (solvers, mesh) development.
4. Experience with Python scripting, C++/C programming languages and high-performance computing libraries (GPU/CUDA, Open MPI, OpenCL) is a plus.