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工作地點
台灣
專業領域
連線與封裝技術
職別
工程師/管理師
職務類型
正職
職務張貼日
2024/03/19
職務說明

1. Develop and implement test methodologies for HBM packages

2. Design and develop test hardware and software

3. Collaborate with design and product teams to ensure package designs meet specifications

4. Develop and execute test plans to validate package designs

5. Analyze test data and provide feedback to design and product teams

6. Develop and maintain test documentation and procedures

7. Participate in cross-functional teams to resolve issues and improve processes

8. Stay up-to-date with industry standards and trends

職務要求

1. Bachelor's degree in Electrical Engineering or related field

2. 3+ years of experience in package test development

3. Experience with HBM package test development is highly desired

4. Strong understanding of semiconductor packaging technology

5. Experience with test hardware and software development

6. Familiarity with statistical analysis tools and techniques

7. Excellent communication and collaboration skills

8. Ability to work independently and as part of a team

9. Strong problem-solving skills