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公司名稱
台灣積體電路製造股份有限公司
工作地點
台灣
專業領域
研究發展
職別
工程師/管理師
職務類型
正職
職務張貼日
2026/07/08
台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。
職務說明
Come and join an innovative and challenging team, where groundbreaking ideas shape the future of semiconductor technology. As an R&D Engineer, you will work on advanced technology development, such as exploratory research in advanced device architectures, device and process integration for manufacturability, advanced module process development, as well as the evaluation of novel materials, equipment, and processes.

1. Research & Pathfinding

(1) New material and new process pathfinding to enable new device architecture with integration.
(2) New tool pathfinding for new materials to enable the next nodes.
(3) Design, execute and analyze experiments to meet R&D engineering specifications.
(4) Process stability & manufacturability improvement for yield and reliability qualification.
(5) Process/tool transfer to development R&D or volume manufacturing (Fab).
(6) Highly motivated individuals with a strong technical background and teamwork skills.

2. Integration

For Device Engineers:

(1) Transistor Architecture & Design: Pioneering device design for advanced nodes.
(2) Advanced Characterization: Defining the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting bench electrical measurements (I-V, C-V).
(3) Simulation & Modeling: Utilizing TCAD (Technology Computer-Aided Design) and HSPICE to simulate device characteristics, optimize performance, and fortify model integrity.
(4) Test Key Design: Crafting precision test key designs to facilitate accurate electrical modeling, design rule validation, and comprehensive device characterization.
(5) Customer design enablement: Providing SPICE Model.

For Integration Engineers (or Process Integration Engineers) :

(1) Process Flow Integration: Integrating devices across various process modules (Lithography, Etch, Thin Films/Epi, Diffusion, CMP) to build a robust, manufacturable baseline for yield and device learning.
(2) Experimentation & Lot Handling: Designing advanced Experiments (DOE) to meet device KPIs. Periodically serving as the on-duty engineer to coordinate and handle device lots in the R&D fab.
(3) Yield & Reliability Learning: Conducting big data analysis (using JMP, Python, or custom iEDA tools) to identify process design weaknesses, hardware issues, or yield detractors.
(4) Technology Transfer: Transitioning the proven, optimized advanced integration baseline process from the R&D phase to fab for high-volume manufacturing.

3. Module R&D Engineer

(1) Pioneer Next-Generation Technologies: Research and develop advanced processes, novel materials, next-generation tooling, and cutting-edge computational/simulation methodologies for leading-edge semiconductor nodes.
(2) Drive High-Impact Innovation: Deliver highly manufacturable, stable, and cost-effective process technologies. Optimize device physics and performance to meet stringent yield, reliability, and qualification standards.
(3) Bridge Lab-to-Fab Scaling: Lead the technology transfer of advanced processes and hardware solutions from R&D phase to High-Volume Manufacturing (HVM) fabs, witnessing your research scale into global production.

4. R&D Process Center

(1) PE: Develop advanced module process, optimizing stability and manufacturability to ensure high yield and reliability. Transfer processes and tools to volume manufacturing while collaborating with cross-functional teams and external suppliers to drive leading-edge module integration. Additionally, manage day-to-day operations, troubleshoot equipment, and mentor technicians to sustain operational excellence.
(2) EE: Manage advanced semiconductor equipment (Diffusion, Thin Film, Lithography, or Etching) by performing warm-ups, troubleshooting, and efficiency enhancements. Plan and execute defect detection projects to analyze performance while collaborating closely with cross-functional engineers and vendors to ensure optimal equipment productivity and stability.
(3) MFG: Oversee daily IC foundry operations, managing work schedules, direct labor, and cross-functional collaboration (PE/PIE/EQ) to ensure consistent service delivery. Drive productivity, manage multiple projects with overlapping deadlines, and analyze data to keep operations running smoothly. Additionally, contribute to process improvements and maintain robotic/detection systems to meet customer and business objectives.
職務要求
1. Master’s degree or Ph.D. in Electrical Engineering, Materials Science & Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry, Optics, or a related scientific/engineering field.
2. Solid understanding of semiconductor physics, chemistry, fabrication equipment, and process integration flows.
3. Strong knowledge of Design of Experiments (DOE) and Statistical Process Control (SPC) principles. Proficiency in programming, data analytics, or machine learning/AI is a plus.
4. Strong technical problem-solving and analytical skills, with a focus on fundamental reasoning rather than purely empirical methods.
5. Hands-on experience with process or hardware tools; a strong sense of ownership and readiness for active presence in an R&D fab/cleanroom environment.
6. Fluent in English with excellent written and verbal communication skills; proven ability to collaborate effectively in cross-functional teams and with external partners.
7. Passionate about pioneering next-generation technologies, with the flexibility to adapt to dynamic R&D environments and evolving business needs.

#LI-DNI
TSMC 企業核心價值
台積公司誠摯招募志同道合的夥伴，與我們一同驅動企業邁向成功。我們深信，核心價值是我們企業文化的基石。因此，應徵者必須認同核心價值，並積極地落實在工作中。 
  • 誠信正直： 說真話、不誇張、不作秀。一旦答應，必定不計代價，全力以赴。
  • 承諾： 同仁全心全意投入公司，抱著「公司成功、我也成功」的心情，熱忱認真地工作，並且做出最大貢獻。因為承諾是雙向的，公司也會為照顧員工權益全力以赴。 
  • 創新：創新是公司成長的泉源，不僅僅是有新的想法，還要執行力，做出改變。 
  • 客戶信任： 我們努力與客戶建立深遠的夥伴關係，並成為客戶信賴且賴以成功的長期重要夥伴。
 ( TSMC 核心價值詳細資訊請參考：https://www.tsmc.com/chinese/aboutTSMC/values)
營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。