公司名稱

台灣積體電路製造股份有限公司

工作地點

台灣

專業領域

資訊技術

職別

主管職

職務類型

正職

職務張貼日

2026/03/25

台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。台積公司為534 個客戶提供服務，生產12,682 種不同產品，被廣泛地運用在各種終端市場，例如高效能運算、智慧型手機、物聯網、車用電子與消費性電子產品等。 進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。

職務說明

1. Android MDM Development: Architect and deliver the in-house Android MDM by Android Enterprise specification.

2. Backend & Infrastructure: Build scalable backend services using Java Spring Boot or Python on Kubernetes, ensuring high availability and orchestrating containerized microservices.

3. Real-time Communication: Design robust bi-directional messaging pipelines by MQTT or WebSockets to enable real-time command execution.

4. OEM Technical Integration: Serve as the primary technical liaison for integration, collaborating with OEM BSP teams to resolve hardware-specific SDK limitations and firmware compatibility issues.

5. Global Deployment: Adapt system architecture to meet business needs with well-design security protection and operational const.

職務要求

【Technical Expertise】

1. Android Mastery: 8+ years in Android Native (Kotlin/Java) development with deep expertise in Android Framework and Device Policy Manager (DPM) for enterprise-grade control.

2. Backend Proficiency: Strong proficiency in server-side development using either Java Spring Boot or Python, with the ability to design high-concurrency RESTful APIs.

3. Kubernetes (K8s) & Cloud Native: Hands-on experience with Kubernetes orchestration, Docker containerization, and managing microservices in production environments.

4. IoT Protocols: Solid understanding of MQTT and WebSockets, with proven experience implementing real-time device-to-server communication architectures.

5. Technical Spec Analysis: Exceptional ability to comprehend complex technical specifications (Android Enterprise/OEM SDKs) and independently translate them into functional, stable code.

【Leadership & Soft Skills】

1. 0-to-1 Capability: Demonstrated "Pioneer Spirit" with the ability to build systems independently without existing teams or infrastructure.

2. Leadership Experience: Proven track record as a Technical Lead or Engineering Manager with the ability to recruit, mentor junior developers, and define technical culture.

3. Domain Adaptability: High willingness to learn semiconductor manufacturing processes quickly and adapt technical solutions to strict factory environments and cleanroom protocols.

4. Communication: Professional proficiency in English is required for technical documentation, global collaboration, and technical negotiations with international hardware vendors.

營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。