Advanced Packaging Technical Manager

公司名稱

台灣積體電路製造股份有限公司

工作地點

台灣

專業領域

研究發展

職別

主管職

職務類型

正職

職務張貼日

2025/02/24

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

職務說明

1. Be responsible for establishing a R&D line, including tool evaluation and process development.

2. Enhance tooling capabilities to meet the demands of advanced packaging products.

3. Establish a standardized methodology for process development and characterization of panel manufacturing processes.

職務要求

1. Master's degree or above in Engineering or a related Science field; a Ph.D. is a plus.

2. 5+ years of project management experience.

3. Experience in panel or substrate related field is a plus.

4. Solid technical insight on advanced packaging lithography, etch, PVD, electroplating processes, equipment, materials, and fundamentals.

5. Possess good and open communication skills, and be able to work in cross-functional teams with both internal and external partners.

6. Hands-on participation and a high level of accountability.

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