Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

1. Master's degree or above in an engineering or scientific field such as Materials Science, Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics. 

2. Experienced in process integration or HV/BCD devices developing and characterization.

3. Innovative problem-solving skills.

4. Familiar with TCAD simulation is a bonus.

5. Process integration & CMOS characterization.

6. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics.

7. Excellent communication skills and the ability to work within cross-functional teams, including internal and external partners.