Role:

• Perform thermo-mechanical characterization of materials using DMA, TMA, TGA, DSC, Rheometer, and Tensile tools to evaluate properties such as thermal expansion, modulus, and viscosity.
• Conduct physical analysis of semiconductor packages, including sample preparation for cross-sectional observation and observation using scanning electron microscopy (SEM).
• Investigate process and material integrity, contributing to the development of defect analysis methodologies and solutions.
• Serve as the owner of analytical instruments, performing routine maintenance, calibration, and troubleshooting as needed to ensure optimal performance.
• Collaborate closely with the quality management department, reporting findings and contributing to quality control efforts for materials and processes at the Tsukuba facility.
• Maintain open communication with HQ departments, providing updates on analysis results, equipment status, and quality management activities.
• Contribute to the development and implementation of new analytical techniques and methodologies to enhance materials characterization capabilities.
• Ensure compliance with safety protocols and regulations in all laboratory activities.

Requirements:

• Bachelor's degree or higher in materials science, mechanical engineering, or a related field. Advanced degree preferred.
• Extensive experience in thermo-mechanical materials characterization techniques, including DMA, TMA, TGA, DSC, Rheometer, and Tensile testing.
• Proficiency in sample preparation techniques for cross-sectional observation and experience with SEM analysis.
• Strong analytical and problem-solving skills, with the ability to troubleshoot and resolve technical issues related to analytical instruments and materials characterization.
• Excellent communication skills and the ability to collaborate effectively with cross-functional teams.
• Proven ability to manage multiple tasks and priorities in a fast-paced environment.
• Experience with quality management systems and processes is a plus.
• Willingness to engage in continuous learning and professional development to stay abreast of advancements in materials characterization techniques and semiconductor packaging technologies.
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