Skip to content
Lab/inline analysis technique and metrology tool development to support TSMC R&D and production on latest silicon process and 3DIC packaging technology

As the development and production of advanced silicon process and 3DIC packaging become more and more challenging, lab/inline analysis techniques and metrology tools play an important role for the success of process development and high-volume production. Candidates with the expertise in material analysis (MA), fault isolation (FI), physical failure analysis (PFA), mechanical analysis, or silicon/3DIC packaging process will be essential for TSMC to develop suitable analysis techniques and metrology solutions to support pathfinding, and process/IP development on TSMC cutting-edge silicon and 3DIC packaging technology


1. Perform research and development work on material analysis, fault isolation, physical failure analysis, or mechanical analysis to understand/predict process and packaging weakness and provide guidance on the solutions.
2. Work with multifunctional teams in HQ including Q&R, process, integration module, and 3D packaging team to understand technology gaps and drive technology development.
3. Co-work with metrology vendors to define metrology roadmap that meets TSMC requirements and enable metrology tools with the required timeline.
4. Lead University joint-development projects by setting clear goals and delivering results to support HQ teams.
1. PhD or Master's degree in Electrical Engineering, Physics, Chemistry, mechanical, or Material related engineering area.
2. At least 12 years of material/mechanical analysis, metrology, or process/product debug in fields relevant to silicon or packaging technology. Hands-on experience on MA, FI, FA, mechanical analysis, or metrology tools is a plus. 
3. Ability to learn new exploratory fields quickly and serve as an effective team leader to trigger the team’s learning agility. Patent filing on related fields is a plus. 
4. Ability to engage in hands-on participation and effectively manage time and resources. 
5. Excellent verbal and written communication, interpersonal skills and desire to work in collaborative, multidisciplinary teams.
6. Ability to travel as needed.