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About Us – Research & Development Process Center (RDPC)

In order to maintain TSMC's leading position in technology and shorten R&D cycle time to expand our competitive advantage, RDPC (RD Process Center) works closely with R&D organizations to achieve the fastest, highest quality, and most cost-effective process development.

Our Goal :

1. Reduce cycle time:

The R&D process requires continuous design of experiments (DOE) and verification to ensure process reliability and mass production. However, it takes time to know the results of these experiments from chip tape-out to experiment results. Therefore, we must strive to shorten the research and development cycle time to obtain results and make improvements in the shortest possible time.

2. Stability:

The equipment on the R&D line needs to be maintained and improved by RDPC. We are at the forefront of technology, and many machines are the first of TSMC. Therefore, Process and Equipment Engineers in RDPC are like "tailors" who can create the most fitted design for each machine to ensure its stability and optimal performance.

3. Variation control:

Minimizing process variation is also a crucial task for RDPC. As the process advances, the process window becomes smaller, requiring stable and high-yield processes. Therefore, precise process control is crucial for stable and high-yield processes (variation control is key).

4. Technology transfer to HVM (High Volume Manufacturing):

Success or failure depends on the ability to mass-produce the research and development results. Therefore, seamless transfer and successful mass production are our ultimate goals to achieve the success and development of the company.


1. Lead advanced module process development during R&D stage.

2. Enhance process stability and manufacturability to improve yield and reliability for qualification.

3. Oversee process/tool transfer to volume manufacturing.

4. Collaborate with cross-functional teams, including ATMD, device, integration, yield, lithography, thin films, and external suppliers, to drive leading-edge integrated module development, control, and improvements.

5. Maintain ownership of day-to-day operations, equipment troubleshooting, and mentorship of technicians.


1. Master's degree or above in Chemical Engineering, Material Science, Chemistry, Physics, or a related engineering discipline.

2. Strong hands-on participation and a strong sense of ownership are required.

3. A strong technical problem-solving and analytical skills, based on fundamental rather than empirical models.

4. Excellent written and verbal communication skills are required.

5. Experience in IC fabrication would be an added advantage.

6. Must be effectively bilingual in Mandarin and English.