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工作地點
台灣
專業領域
製造
職別
主管職
職務類型
正職
職務張貼日
2023/08/03
職務說明
A. Team Lead:
 
1.Lead the team to transfer technology from R&D mother fab, co-develop/optimize module process, and take charge of technology and products qualification so as to establish world largest volume production of advanced logic products(16nm & beyond) or specialty products(HV, BCD, CIS, embedded memory, etc.)
2.Drive and optimize process robustness, boost device performance and improve yield from a green field.
3.Develop sub-node technologies beyond current products.
4.Drive the cost reduction and tool productivity.

B. Technical Staff:

1.Play as a technical expert to address bottlenecks of module process and device technologies.
2.Lead the project team for fundamental study in process, hardware and materials characterization.
職務要求
1. Master’s or PhD degree in Science/Engineering field.
2. 15+ years (Master) or 10+ years (PhD) of experiences in semiconductor process module development.
3. The candidate must be experts resident in at least one key process modules including Etch, Cleaning, Thin Films(Epi/CVD/PVD), Litho, EUV, CMP and Diffusion.
4. The candidate must have high volume production experiences in 12'' fab or have technology development experience in 16nm & beyond logic technology.
5. The candidate must possess leadership qualities capable of influencing and guiding the organization.
6. Good at English and Mandarin communication.