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公司名稱
台灣積體電路製造股份有限公司
工作地點
台灣
專業領域
產品發展
職別
主管職
職務類型
正職
職務張貼日
2023/08/03
職務說明
1. Conduct mechanical modeling for advanced packaging technology.
職務要求
1. Master’s or PhD degree in Mechanical / Materials related field. PhD degree is preferred.
2. The candidate must have advanced packaging knowledge and excellent capabilities in stress modeling.
3. Required simulation skills : finite element analysis, structural optimization analysis, nonlinear and linear analysis, familiar with computer aided engineering software (HyperMesh, ANSYS, Abaqus).
4. 3+ years of experiences in thermo-mechanical stress modeling is preferred.
5. Good at English communication.
6. The qualified candidate needs work in Japan office or Taiwan HQs.