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公司名稱
台灣積體電路製造股份有限公司
工作地點
台灣
專業領域
人力資源
職別
主管職
職務類型
正職
職務張貼日
2023/08/03
職務說明
1. Global relocation package design, especially for new sites.
2. Partnering with region HR in people deployment support. (e.g., overseas transfer and overseas assignment management).
3. New site planning & projects related to above scope.
職務要求
1. Capable to probe potential concerns, integrate multiple inputs & processes and develop solutions to enhance effectiveness.
2. General knowledge of employment laws and HR practices.
3. Proficient in Microsoft Office applications.
4. Fluent in both spoken and written English. Fluent in Japanese is a plus.