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Company
Taiwan Semiconductor Manufacturing Company Limited, TSMC
Location
Taiwan
Job Category
R&D
Job Type
Engineer / Admin
Employment Type
Regular
Posted
Aug 02, 2024
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

Aspire to be a part of a visionary team that develops world-class, cutting-edge technology for the A14 platform? This is a call to those who wish to delve into the realm of interconnect and chip/package (2D/3D) co-optimization, where your work will be integral to our success.
Job Responsibilities
1. Championing Technological Excellence:

(1) Optimization Wizardry: Ensure the A14 program excels by harmonizing process requirements across performance, yield, reliability, and manufacturability through strategic process integration and baseline maintenance.
(2) Design & Validation Expertise: Lead the tape-out process and rigorously test key designs to validate design rules, refine electrical modeling, and elevate yield outcomes.
(3) Benchmarks & Characterization: Analyze and characterize the electrical performance relative to the process, establish SPICE modeling benchmarks, and perform selective bench measurements to guarantee precision and quality.

2. Collaborative Innovation:

(1) Analytical Problem-Solving: Bring your innovative mindset to team efforts, using data analysis to uncover process issues and co-developing new processes as solutions alongside talented peers.
(2) Process Evolution: Play a pivotal role in evolving processes from advanced integration baselines to full-scale volume production, ensuring a smooth transition and exemplary results.
Job Qualifications
1. A master’s degree or Ph.D. in Electronics Engineering, Materials Science, Chemical Engineering, or a knowledge domain in semiconductor interconnect, advanced packaging or a related field.
2. Personal traits:

(1) Growth mindset with dedication to learning.
(2) Collaborative with good communication skills, able to work with cross-functional teams.
(3) Proactive, self-driven, and goal-oriented with strong technical problem-solving abilities, analytical skills, and a strong sense of ownership.

3. Experience in the process integration, semiconductor interconnect processes or advanced 3D packaging is preferred.
4. Good command of English is preferred.

Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.