(1) To be responsible to drive leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices in order to meet scaling, performance, reliability, and manufacturability requirements.

(2) Identify and solve IC process and device problems.

(1) Master Nano Diffusion, Thin Film, Lithography, Etching, or Metrology equipment. 

(2) Sustain and troubleshoot issues with high-tech equipment.

(3) Improve and enhance the efficiency and productivity of equipment.

(4) Plan and execute the analysis or defect detection projects.

(5) Communicate with cross-functional engineers or vendors.

(1) A highly motivated individuals with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products.

(2) Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 

(3) Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians.

(1) 負責半導體產品線機台設備維修及保養

(2) 管理及改善機台零件系統、包含廠商與下包商之零件備品管理

(3) 設計機台保養制具及流程改善以增進機台穩定性

(4) 需配合日、夜/假日班輪值(約每四週輪值一次大夜班，一次輪值六天) 

(5) 薪資：起薪39,400元起，年薪含分紅獎金、大夜津貼、夜班獎金、額外獎金

(1) Master's degree or above in Material Science, Electrical Engineering, Electronics, Chemical engineering, Chemistry or Physics.

(2) Experience in semiconductor industry will be advantageous.

(3) Familiar with EXCEL/PPT/WORD/ statistical software (e.g., statistical,JMP,etc.) will be a plus.

(4) Good communication skill and logic thinking is preferred.

(5) Must be effectively bilingual in Mandarin and English.

(1) Master's degree or above in Electronics, Electrical Engineering, Mechanical and Automation Engineering related fields.

(2) No experience required. However, experience in equipment maintenance or improvement is a plus.

(3) Have basic mechanical-related knowledge. Having the semiconductor processes knowledge is a plus. 

(4) Good problem-solving skills, communication ability, team spirit, active learning attitude and is fluent in English.

(1) Master's degree or above in engineering or scientific field such as Materials Science, Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics.

(2) Solid technical understanding of IC processing equipment, integrated flow, chemistry and physics.

(3) Exhibit good and open communication skills, be able to work within cross-functional teams, including internal and external partners.

(4) Fluent in English.

(5) Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.

(6) Flexibility in changing priorities and responsibilities to support business needs.

(7) Hands-on participation and a strong sense of ownership.

(8) Willingness to make frequent fab presence.

(1) Master's degree or above in Industrial Engineering, Manufacturing, Production Engineering, Industrial Management, Information System, Mechanical and Automation Engineering or related field.

(2) Strong experience in semiconductor. manufacturing experience is highly preferred.

(3) Demonstrated knowledge of OM, IE, IT or related field is required.

(4) Having the semiconductor processes knowledge is preferred.

(5) Adequate in English and Mandarin.

(6) Must be an enthusiastic and dedicated individual with the capability to motivate and lead using a team approach.

(7) Shift arrangement is required.

(1) 具備大學學歷，且為電機、電子、機械、自動控制、冷凍空調工程等相關科系

(2) 需有機械相關的基礎知識；有半導體製程知識者尤佳

(3) 需有問題解決、溝通表達、團隊精神、主動學習等能力

(4) 需有基本英文讀寫能力

(5) 需能配合大多數工作時間內，穿著無塵衣且將在無塵室環境中工作

(6) 需經過至多十二個月的相關訓練並通過認證，始得成為模組副工程師