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Company
Taiwan Semiconductor Manufacturing Company Limited, TSMC
Location
Taiwan
Job Category
Manufacturing (fabs)
Job Type
Engineer / Admin
Employment Type
Regular
Posted
Jun 25, 2024
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

In R&D, module is responsible for technology research, development, and implementation on the production line, with a focus on TSMC's mainstream technologies such as advanced process equipment for lithography, etching, diffusion, and thin film, required for N2, A14, and A10 nodes. Job responsibilities include the research and application of new materials, joint development of new process equipment with suppliers, development of process module technology and measurement technology for new components, addressing failures during the new process development, improving yield and transistor performance, stability assessment and cost reduction in the early stage of mass production, establishment of standard operating procedures, and transfer of technology to mass production plants.

To face the fierce market competition, TSMC must continuously maintain technological leadership and shorten the research and development cycle time, to expand its competitive advantage. Therefore, RDPC needs to work closely with various R&D departments to achieve the fastest, highest quality, and most cost-effective process development.

Our Goal :

1. Reduce cycle time:
The R&D process requires continuous design of experiments (DOE) and verification to ensure process reliability and mass production. However, it takes time to know the results of these experiments from chip tape-out to experiment results. Therefore, we must strive to shorten the research and development cycle time to obtain results and make improvements in the shortest possible time.

2. Stability:
The equipment on the R&D line needs to be maintained and improved by RDPC. The R&D center is at the forefront of technology, and many machines are the first of TSMC. Therefore, RDPC's process and equipment engineers must have the ability to "put on clothes and modify clothes" to ensure the stability and optimal operation of the equipment.

3. Variation control:
Minimizing process variation is also an important task for RDPC. With the advancement of the process, the tolerance of process window becomes smaller. Therefore, precise process control is crucial for stable and high-yield processes (variation control is key).

4. Transfer to HVM:
Success or failure depends on the ability to mass-produce the research and development results. Therefore, seamless transfer and successful mass production are our only goals to achieve the success and development of the company.

5. From Moore's Law to the era of AI Era/3D IC:
Transitioning from artificial intelligence to smart manufacturing, through the strategies and collaborations of tech giants, unlocking the future of the global semiconductor industry.
Job Responsibilities
1. Leading advanced module process development during the R&D stage.
2. Enhancing process stability and manufacturability to improve yield and reliability for qualification.
3. Overseeing process/tool transfer to volume manufacturing.
4. Working with teams that include IIP/3D IC module, device, integration, yield, lithography, thin films, and external suppliers to drive leading-edge integrated module development, control, and improvements.
5. Maintaining ownership of day-to-day operations, equipment troubleshooting, and mentoring technicians.
Job Qualifications
1. Master's degree or above in Chemical Engineering, Material Science, Chemistry, Physics, or a related engineering discipline is required.
2. Strong hands-on participation and a strong sense of ownership are required.
3. Demonstrated technical problem-solving and analytical skills, based on fundamental rather than empirical models.
4. Excellent written and verbal communication skills are required.
5. Experience in IC fabrication would be an added advantage.
6. Proficiency in both Mandarin and English.

Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.