1. Develop and implement test methodologies for HBM packages.
2. Design and develop test hardware and software.
3. Collaborate with design and product teams to ensure. package designs meet specifications.
4. Develop and execute test plans to validate package designs.
5. Analyze test data and provide feedback to design and product teams.
6. Develop and maintain test documentation and procedures.
7. Participate in cross-functional teams to resolve issues and improve processes.
8. Stay up-to-date with industry standards and trends.
1. Bachelor's degree in Electrical Engineering or related field.
2. 3+ years of experience in package test development.
3. Experience with HBM package test development is highly desired.
4. Strong understanding of semiconductor packaging technology.
5. Experience with test hardware and software development.
6. Familiarity with statistical analysis tools and techniques.
7. Excellent communication and collaboration skills.
8. Ability to work independently and as part of a team.
9. Strong problem-solving skills.
Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.