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Company
Taiwan Semiconductor Manufacturing Company Limited, TSMC
Location
Taiwan
Job Category
More-than-Moore Technology
Job Type
Engineer / Admin
Employment Type
Regular
Posted
Aug 03, 2023
Job Responsibilities
1. R&D Process Engineer (Etch) 
    
    (1) A highly motivated individuals with a strong technical background and capabilities to develop and sustain etch 
          process technologies for R&D specialty products. 
    (2) Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians. 
    (3) Co-work with other module, integration, or external suppliers to drive leading-edge integrated module development, control and 
          improvements.

2. R&D Process Engineer 
  
    (1) Responsible for CVD/PVD/CMP/Grind/Trim development activities in R&D specialty module. 
    (2) Deliver innovation and solution to conquer the problems in wafer stacking processes. 
    (3) Maintain processes POR and SPC control.

3. R&D Integration Engineer 

     (1) Responsible for lot handling and process flow setup. 
     (2) Process flow optimization to improve WAT or yield performance. 
     (3) Need support holiday on-duty.
Job Qualifications
1. Minimum Master degrees in an engineering and scientific field such as Materials Science, Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics.
2. 1 year or more in :
    (1) CVD/PVD/CMP/Grind/Trim process 
    (2) integration for semiconductor is a plus.

3. Solid technical understanding of IC processing equipment, integrated flow, chemistry and physics.
4. Good communication with module engineers and team work.
5. Strong in technical background and data analysis skills.
6. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
7. Flexibility in changing priorities and responsibilities to support business needs.
8. Hands-on participation and a strong sense of ownership.
9. English capability is a plus.