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Company
Taiwan Semiconductor Manufacturing Company Limited
Location
Taiwan
Career Area
Accessibility Inclusion
Job Type
Engineer / Admin
Employment Type
Regular
Posted
Mar 17, 2026
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
Taiwan Semiconductor Manufacturing Company (TSMC) is dedicated to fostering a friendly and inclusive work environment while actively safeguarding the employment rights of individuals with accessabilities. In compliance with the "People with Disabilities Rights Protection Act," we have specially designed a dedicated talent portal for individuals with accessabilities. We sincerely welcome candidates holding valid disability identification to join TSMC and work with us to shape the future of technology!
Job Responsibilities
At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers.

Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area.

1. Physical Designer

The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements.

2. Standard Cell Engineer

(1) Pathfinding of library characterization for leading edge tech nodes.
(2) Support industrial standard library kits generation and QC.
(3) In-house library generation flow and/or utility development.
(4) RC parasitic extraction analysis and APR related analysis.

3. Layout Engineer

(1) IC layout for advanced technology (Std. cell/Memory/AMS/IO).
(2) Layout structure development for new technology.
(3) Pathfinding for new technology development.
(4) Customer engagement and layout support.
(5) Design and technology co-optimization (DTCO).
(6) AI and automation for layout and physical design.

4. System and Chip Design Solutions Development


5. FE design & DFT

(1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG).
(2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc.
(3) Technology benchmarking for PPA evaluation of the advanced nodes.
(4) DTCO (Design & Technology Co-Optimization) pathfinding and development.

6. SRAM Engineer

(1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications.
(2) RRAM/MRAM, emerging memory development.
(3) In memory computing research and development.

7. Design Flow/Methodology

(1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support.
(2) Advanced technology design development flow development and technical support.
(3) Automation program development to support design kits and flow development productivity/quality.
Job Qualifications
1. Master's degree in Electrical Engineering or Computer Engineering.
2. Strong proficiency in speaking and writing English.
3. Thorough understanding of place and route flow.
4. Excellent interpersonal and communication skills.
5. Self-motivated and possess excellent team spirit.
6. A valid disability identification issued in Taiwan is required.


#LI-DNI
Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.