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Company
Taiwan Semiconductor Manufacturing Company Limited, TSMC
Location
Taiwan
Job Category
Manufacturing (fabs)
Job Type
Engineer / Admin
Employment Type
Regular
Posted
Feb 06, 2025
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

We are seeking a skilled and motivated Equipment Engineer for our team. In this role, you will be entrusted with maintaining, troubleshooting, and optimizing equipment within our fabrication (fab) environment. As an Equipment Engineer you will work out of our Tainan office while also collaborating with other regions in various countries such as the United States, Germany, and Japan. Although most employees speak Mandarin in our Taiwan office, strong communication skills in English will be essential for effective collaboration across diverse teams.
Job Responsibilities
Responsibilities & Scope

1. Handle Nano Diffusion, Thin Film, or Etching equipment.
2. Improve and enhance the efficiency of equipment.
3. Plan and execute the analysis or defect detection projects.
4. Communicate with cross-functional engineers or vendors in both English and Mandarin.
5. Document processes and improvements in both English and Mandarin.
6. Training and Mentoring technicians and/or new engineers in both English and Mandarin.
Job Qualifications
1. Bachelor’s degree and above is required, with major(s) in Electronics, Electrical Engineering, Mechanical and Automation Engineering, or other related fields.
2. Have experience with equipment maintenance or improvement.
3. Have basic mechanical related knowledge. 
4. Have semiconductor processes knowledge.
5. Problem solving skills, communication ability, team spirit, and active learning attitude.