Role
Handle IC package assembly oS (on-Substrate) process, including CoW(Chip on Wafer) oS and InFO (Fan Out) oS and MCM(Multi Chips Module) package.
Handle logistical job, including substrates, finished packages, raw  material, spare parts packaging, shipping and relevant documents preparation.   
Arrange DoE condition and schedule.
Will be assigned to other activities as needed.

Qualifications
Bachelor major in following fields (Electrical Engineering / Electronics / Material Science / Chemical Engineering / Chemistry / Physics / Physical Engineering)
Prior experience in IC assembly / packaging is a plus
Hands-on participation and a strong sense of ownership is required
Good problems solving skills, communication ability, team spirit and active learning are required. Proficient in Japanese and English. Basic Chinese language skill is a plus. 

About us
 

就業条件

・勤務地

茨城県つくば市　（変更の範囲）会社の定める範囲

・就業時間

月～金

9：00-18：00

・福利厚生

健康保険、厚生年金、雇用保険、労働災害補償保険（労災）、確定拠出年金（マッチング拠出あり）、退職金制度、年次有給休暇

・休日休暇

土日祝

夏季休暇、年末年始休暇、特別休暇等

会社カレンダーによる休暇制度に準ずる

・選考プロセス

書類選考➡Online面接1回➡Onsite面接2回(1日のうちに実施)➡オファー