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Company
Taiwan Semiconductor Manufacturing Company Limited
Location
Taiwan
Career Area
IC Interconnect & Packaging Technology
Job Type
Engineer / Admin
Employment Type
Regular
Posted
Sep 10, 2024
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

台積電誠邀您加入全球半導體產業的領導者行列。我們正在進行大規模徵才，
尋找具備高技術專業知識且充滿熱情夥伴，與我們共同創造未來科技的無限可能。
Job Responsibilities
As a tool sponsor, equipment engineers need to be responsible for the equipment's performance and efficiency improvement. Also, as a KPI sponsor, equipment engineers need to spend more time maintaining the equipment operation.

Job Contents:

1. Handle packaging-related equipment (including 3DIC, CoWoS, InFO, oS, etc.) and complete preventive maintenance.
2. Analyze and solve equipment issues and enhance the tools.
3. Improve the quality, productivity, and cost of the equipment (e.g., develop BKM, propose CIP).
4. Plan and execute defect detection projects (e.g., develop 2nd source, plan the proposal, adjust the equipment) by building a defense system (e.g., FDC/AllEC/TIDS/ALM).
5. Alert the abnormal events and recover the problem (e.g., CXF, pressure drop, earthquake, water drop).
6. Optimize T/S SOP and define guidelines.
7. Join external audits, e.g., QM Audit, PIP Audit, PTS Audit, PMQ Audit, etc.
8. Communicate with cross-functional engineers or vendors (e.g., co-work with PE and find the gap in equipment to solve inline/WAT/Defect/Yield issues, etc.).
Job Qualifications
1. Master’s degree and above in Electronics, Electrical Engineering, or Mechanical-related fields.
2. Familiar with packaging and bumping equipment technology.
3. Having the semiconductor processes knowledge is a plus.
4. Good problem-solving skills, communication ability, team spirit, active learning attitude and is adequate in English.
5. Work location: Taoyuan (Longtan), Hsinchu, Miaoli (Zhunan), Taichung, Chaiyi, Tainan.

Attributes & Skills:

1. Good people interaction skills.
2. Logical and systematic thinking.
3. Good project management skills.

Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.