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Company
Taiwan Semiconductor Manufacturing Company Limited, TSMC
Location
Taiwan
Job Category
Product Development
Job Type
Manager
Employment Type
Regular
Posted
Aug 03, 2023
Job Responsibilities
1. Conduct mechanical modeling for advanced packaging technology.
Job Qualifications
1. Master’s or PhD degree in Mechanical / Materials related field. PhD degree is preferred.
2. The candidate must have advanced packaging knowledge and excellent capabilities in stress modeling.
3. Required simulation skills : finite element analysis, structural optimization analysis, nonlinear and linear analysis, familiar with computer aided engineering software (HyperMesh, ANSYS, Abaqus).
4. 3+ years of experiences in thermo-mechanical stress modeling is preferred.
5. Good at English communication.
6. The qualified candidate needs work in Japan office or Taiwan HQs.