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Taiwan Semiconductor Manufacturing Company Limited, TSMC
Job Category
Manufacturing (fabs)
Job Type
Engineer / Admin
Employment Type
Jun 26, 2024
To face the fierce market competition, TSMC must continuously maintain technological leadership and shorten the research and development cycle time, to expand its competitive advantage. Therefore, RDPC needs to work closely with various R&D departments to achieve the fastest, highest quality, and most cost-effective process development.

Our Goal :

1. Reduce cycle time:
The R&D process requires continuous design of experiments (DOE) and verification to ensure process reliability and mass production. However, it takes time to know the results of these experiments from chip tape-out to experiment results. Therefore, we must strive to shorten the research and development cycle time to obtain results and make improvements in the shortest possible time.

2. Stability:
The equipment on the R&D line needs to be maintained and improved by RDPC. The R&D center is at the forefront of technology, and many machines are the first of TSMC. Therefore, RDPC's process and equipment engineers must have the ability to "put on clothes and modify clothes" to ensure the stability and optimal operation of the equipment.

3. Variation control:
Minimizing process variation is also an important task for RDPC. With the advancement of the process, the tolerance of process window becomes smaller. Therefore, precise process control is crucial for stable and high-yield processes (variation control is key).

4. Transfer to HVM:
Success or failure depends on the ability to mass-produce the research and development results. Therefore, seamless transfer and successful mass production are our only goals to achieve the success and development of the company.

5. From Moore's Law to the era of AI Era/3D IC:
Transitioning from artificial intelligence to smart manufacturing, through the strategies and collaborations of tech giants, unlocking the future of the global semiconductor industry.
Job Responsibilities
1. Handling Nano Diffusion, Thin Film, Lithography or Etching and stacking equipment.
2. Troubleshooting and repairing high-tech equipment.
3. Enhancing the efficiency of the equipment to improve production yield.
4. Planning and executing analysis projects or defect detection.
5. Collaborating with cross-functional engineers or vendors to ensure smooth operations.
Job Qualifications
1. Bachelor's degree or above in Electronics, Electrical Engineering, Mechanical and Automation Engineering or related fields.
2. No prior experience necessary; experience in equipment maintenance or improvement is a plus.
3. Basic mechanical knowledge is required,with knowledge of semiconductor processes being a plus.
4. Strong problem-solving skills, effective communication, teamwork, active learning attitude and good command of English.