Direkt zum Inhalt
Unternehmen
Taiwan Semiconductor Manufacturing Company Limited
Ort
Taiwan
Karrierebereich
Forschung & Entwicklung
Art des Jobs
Ingenieur / Verwaltung
Art der Beschäftigung
Regulär
Veröffentlicht
11.03.2025
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.
Zuständigkeiten
1. Advanced panel level packaging development for CoPoS technology.
2. Exploratory panel level packaging process/material/tool development for new applications.
3. Process stability/manufacturability improvement for yield and reliability qualification.
4. Responsible for transferring the process/material/tool for mass production.
Qualifikationen
1. Master's degree or above in Chemical Engineering, Material Science, Chemistry, Physics, Optoelectronics, Mechanical Engineering, or a related engineering discipline.
2. Hands-on participation and a strong sense of ownership.
3. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models.
4. Growth mindset and open-minded communication.
5. Experience in solder joint, FCB, TCB; underfill dispensing; molding, grinding; temporary bonding/de-boning; sawing; and laser field.
6. Work Location: Zhunan; relocation to Longtan may be necessary depending on job requirements.