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Unternehmen
Taiwan Semiconductor Manufacturing Company Limited
Ort
Taiwan
Karrierebereich
IC-Verbindungstechnik & Verpackungstechnik
Art des Jobs
Ingenieur / Verwaltung
Art der Beschäftigung
Regulär
Veröffentlicht
23.01.2025
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
Zuständigkeiten

1. Develop, test, and integrate HBM solutions into products.
2. Collaborate with cross-functional teams to ensure successful integration of HBM solutions. 
3. Work closely with memory vendors to develop and optimize HBM solutions. 
4. Create and maintain technical documentation related to HBM integration and testing. 
5. Troubleshoot and resolve issues related to HBM integration and performance. 
6. Participate in the development of new products and technologies related to HBM.

Qualifikationen

1. Bachelor's degree in Electrical Engineering, Computer Science, or related field. 
2. 5+ years of experience in memory design and integration. 
3. Strong understanding of HBM technology and its implementation. 
4. Experience with memory controller design and testing. 
5. Knowledge of circuit design, signal integrity, and power delivery. 
6. Excellent problem-solving skills. 
7. Strong communication and interpersonal skills.