Direkt zum Inhalt
Unternehmen
Taiwan Semiconductor Manufacturing Company Limited
Ort
Taiwan
Karrierebereich
IC-Design-Technologie
Art des Jobs
Manager / Führungskraft
Art der Beschäftigung
Regulär
Veröffentlicht
03.08.2023
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

In R&D, Design and Technology Platform (DTP) provides differentiated and world-leading design solutions to enable the implementation of System on Chip (SoC) for leading AI/HPC, communication, automotive and IoT applications on TSMC's diverse silicon and packaging technology platform. We work with the world's leading SoC design teams and ecosystem experts to promote industry-leading process design kits (PDKs) and reusable design blocks for the semiconductor intellectual property core (IP), including standard cell libraries, embedded memory, general-purpose input/output (GPIO), simulation and interface IP, as well as electronic design automation (EDA) tools and design flows for monolithic SoCs and heterogeneous 3DICs. This allows us to accelerate the process of transforming innovation into silicon chips and creating revolutionary changes in daily life!
Zuständigkeiten
1. Lead APR team on tapeout projects, includes physical design and signoff
2. Responsible for advanced technology APR & 3DIC design solution research and development
3. Innovations on APR and 3DIC design domains
4. Cross sites projects coordination and management
Qualifikationen
1. Master or PhD Computer engineering or EE with 6+ years of experience in physical design
2. Familiar with PnR and Signoff (Physical verification, PDN, timing)
3. Familiar with programming languages (shell, python, TCL) & C/C++
4. Familiar with 3DIC implementation flow is a plus
5. Open communication and teamwork spirit
6. Proactive and creativity
7. Good at English and Chinese